High-temperature and high-energy-density polymer dielectrics for capacitive energy storage

被引:0
作者
Zhou, Yao [1 ]
Li, Qi [1 ]
机构
[1] Tsinghua Univ, State Kay Lab Power Syst, Dept Elect Engn, Beijing 100084, Peoples R China
来源
2018 IEEE 2ND INTERNATIONAL CONFERENCE ON DIELECTRICS (ICD) | 2018年
基金
北京市自然科学基金;
关键词
Capacitors; energy storage; dielectric properties; high temperature; CHARGE-DISCHARGE EFFICIENCY; NANOCOMPOSITES;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
High-temperature and high-energy-density polymer dielectrics for capacitive energy storage are critical in capacitors orient to harsh-environment application. The dielectric properties of poly(tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride) (THV) terpolymer are investigated in a broad temperature range. It was found that the thermal stability of the THV terpolymer is significantly improved and a melting temperature of 226 degrees C can be achieved. Due to the higher dielectric constant of 3.6, the THV terpolymer shows 64% higher discharged energy density compared with BOPP. Its high melting temperature, low leakage current, high discharged energy density and high charge-discharge efficiency make THV potentially to be used as dielectric films for high-temperature and high-energy-density capacitive energy storage application.
引用
收藏
页数:4
相关论文
共 11 条
  • [1] High-Performance Polymers Sandwiched with Chemical Vapor Deposited Hexagonal Boron Nitrides as Scalable High-Temperature Dielectric Materials
    Azizi, Amin
    Gadinski, Matthew R.
    Li, Qi
    Abu AlSaud, Mohammed
    Wang, Jianjun
    Wang, Yi
    Wang, Bo
    Liu, Feihua
    Chen, Long-Qing
    Alem, Nasim
    Wang, Qing
    [J]. ADVANCED MATERIALS, 2017, 29 (35)
  • [2] A dielectric polymer with high electric energy density and fast discharge speed
    Chu, Baojin
    Zhou, Xin
    Ren, Kailiang
    Neese, Bret
    Lin, Minren
    Wang, Qing
    Bauer, F.
    Zhang, Q. M.
    [J]. SCIENCE, 2006, 313 (5785) : 334 - 336
  • [3] Sandwich-structured polymer nanocomposites with high energy density and great charge-discharge efficiency at elevated temperatures
    Li, Qi
    Liu, Feihua
    Yang, Tiannan
    Gadinski, Matthew R.
    Zhang, Guangzu
    Chen, Long-Qing
    Wang, Qing
    [J]. PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, 2016, 113 (36) : 9995 - 10000
  • [4] Flexible high-temperature dielectric materials from polymer nanocomposites
    Li, Qi
    Chen, Lei
    Gadinski, Matthew R.
    Zhang, Shihai
    Zhang, Guangzu
    Li, Haoyu
    Haque, Aman
    Chen, Long-Qing
    Jackson, Thomas N.
    Wang, Qing
    [J]. NATURE, 2015, 523 (7562) : 576 - +
  • [5] Solution-processed ferroelectric terpolymer nanocomposites with high breakdown strength and energy density utilizing boron nitride nanosheets
    Li, Qi
    Zhang, Guangzu
    Liu, Feihua
    Han, Kuo
    Gadinski, Matthew R.
    Xiong, Chuanxi
    Wang, Qing
    [J]. ENERGY & ENVIRONMENTAL SCIENCE, 2015, 8 (03) : 922 - 931
  • [6] Status quo and future prospects for metallized polypropylene energy storage capacitors
    Rabuffi, M
    Picci, G
    [J]. IEEE TRANSACTIONS ON PLASMA SCIENCE, 2002, 30 (05) : 1939 - 1942
  • [7] Capacitors
    Sarjeant, WJ
    Zirnheld, J
    MacDougall, FW
    [J]. IEEE TRANSACTIONS ON PLASMA SCIENCE, 1998, 26 (05) : 1368 - 1392
  • [8] Capacitive components for power electronics
    Sarjeant, WJ
    Clelland, IW
    Price, RA
    [J]. PROCEEDINGS OF THE IEEE, 2001, 89 (06) : 846 - 855
  • [9] Optimal design of high temperature metalized thin-film polymer capacitors: A combined numerical and experimental method
    Wang, Zhuo
    Li, Qi
    Trinh, Wei
    Lu, Qianli
    Cho, Heejin
    Wang, Qing
    Chen, Lei
    [J]. JOURNAL OF POWER SOURCES, 2017, 357 : 149 - 157
  • [10] Semicrystalline Polymers with High Dielectric Constant, Melting Temperature, and Charge-Discharge Efficiency
    Zhang, Shihai
    Zou, Chen
    Kushner, Douglas Ian
    Zhou, Xin
    Orchard, Raymond J., Jr.
    Zhang, Nanyan
    Zhang, Q. M.
    [J]. IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2012, 19 (04) : 1158 - 1166