Printed Circuit Board Encapsulation and Integration of High-Speed Polymer Photodiodes

被引：1
作者：
Valouch, S. [1 ]
Oeguen, C. M.
Kettlitz, S. W.
Zuefle, S.
Christ, N. S.
Lemmer, U.
机构：
[1] Univ Karlsruhe TH, Light Technol Inst LTI, D-76131 Karlsruhe, Germany
来源：
SENSOR LETTERS | 2010年 / 8卷 / 03期
关键词：
Lab On Chip; Printed Circuit Board; Organic Photodetector; Photodiode; Encapsulation; Integration; High Frequency;
D O I：
10.1166/sl.2010.1283
中图分类号：
O65 [分析化学];
学科分类号：
070302 ; 081704 ;
摘要：
We present the encapsulation and integration of polymer photodiodes based on a bulk-heterojunction of regioregular poly(3-hexylthiophene-2,5-diyl) (P3HT) and [6,6]-phenyl-C-61-butyric acid methyl ester (PCBM) using a printed circuit board (PCB) with a capillary underfill technique. Fall times below 250 ns are achieved. High-speed PCB encapsulated organic devices could provide cost effective solutions for lab-on-a-chip systems or optical interconnects.
引用
收藏
页码：392 / 394
页数：3
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