Magnetic-Sensitive Crack Sensor with Ultrahigh Sensitivity at Room Temperature by Depositing Graphene Nanosheets upon a Flexible Magnetic Film

被引:9
作者
Huang, Jianyu [1 ,2 ]
Ma, Zheng [1 ]
Wu, Zhenhua [1 ]
Peng, Linghui [3 ]
Su, Bin [1 ,2 ]
机构
[1] Huazhong Univ Sci & Technol, Sch Mat Sci & Engn, State Key Lab Mat Proc & Die & Mould Technol, Wuhan 430074, Hubei, Peoples R China
[2] Shenzhen Huazhong Univ Sci & Technol Res Inst, Shenzhen 518057, Guangdong, Peoples R China
[3] Monash Univ, Dept Chem Engn, ARC Hub Computat Particle Technol, Clayton, Vic 3800, Australia
关键词
crack structure; flexible; graphene; magnetic sensor; STRAIN SENSORS; MAGNETORESISTANCE; COMPOSITE;
D O I
10.1002/aelm.202100335
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Flexible magnetic field sensors attract significant interests in magnetic detection and flexible electronics. However, two challenges, low sensitivity, and limited working range, impede their practical application. Herein, a new type of magnetic-sensitive crack sensor (M-CS) by depositing graphene nanosheets upon a flexible magnetic film through a facial infrared drying technique is reported. The M-CS exhibits an ultrahigh sensitivity (relative resistance change up to 4.0 x 10(10)) toward a moderate magnetic field of 43 mT at room temperature. In addition, the M-CS shows a long cycling stability over 10 000 cycles. Such a superior sensitivity is attributed to physically cutting/recovering the pathways of electron transport through nanosheets' separation/contact. Diverse experimental parameters, such as the concentration of graphene solution and the thickness of bottom magnetic substrates, have been tailored to improve the magnetic sensitivity of M-CS. Furthermore, the array of M-CSs with different relative resistance change can be used as the cipher key to recognize aimed magnetic signal without contact. It is believed that the M-CS with an ultrahigh magnetic sensitivity at operational condition and long-term stability could benefit the development of magneto-sensitive sensors, and exploit the application of 2D materials in flexible electronic devices.
引用
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页数:8
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