Hot embossed polymeric optical waveguides

被引:1
作者
Choi, CG [1 ]
Kim, JT [1 ]
Han, SP [1 ]
Ahn, SH [1 ]
机构
[1] Elect & Telecommun Res Inst, Basic Res Lab, Opt Interconnect Team, Taejon 305350, South Korea
来源
ACTIVE AND PASSIVE OPTICAL COMPONENTS FOR WDM COMMUNICATIONS IV | 2004年 / 5595卷
关键词
hot embossing; polymeric optical waveguides; passive fiber alignment; parallel optical interconnection module; variable optical attenuator; optical printed circuit boards;
D O I
10.1117/12.571145
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Polymer waveguides have attracted a great deal of attention for their potential applications as optical components in optical communications, optical interconnections and optical sensors because they are easy to manufacture at a low temperature, and they have a low processing cost. Hot embossing is powerful and effective tools to produce a large volume of waveguides and structure high-precision micro/nano patterns of thin polymer films using a stamp for optical applications. In this work, fabrication techniques of hot embossed polymeric optical waveguides for parallel optical interconnection module, multi-channel variable optical attenuator and optical printed circuit boards are demonstrated. The single- and multi-mode waveguides are produced by core filling and UV curing processes. New approaches to fabricating single-mode polymeric waveguides with the high thermal stability in thermosetting polymers and two-dimensional multi-mode polymeric waveguides for high-density parallel optical interconnections as well as a simultaneous fabrication of single-mode polymeric waveguides with micro pedestals for passive fiber alignment are also reported.
引用
收藏
页码:98 / 111
页数:14
相关论文
共 16 条
[1]   Fabrication of LIGA mold inserts [J].
Bacher, W ;
Bade, K ;
Matthis, B ;
Saumer, M ;
Schwarz, R .
MICROSYSTEM TECHNOLOGIES, 1998, 4 (03) :117-119
[2]   Polymer waveguide devices with passive pigtailing: an application of LIGA technology [J].
Bauer, HD ;
Ehrfeld, W ;
Harder, M ;
Paatzsch, T ;
Popp, M ;
Smaglinski, I .
SYNTHETIC METALS, 2000, 115 (1-3) :13-20
[3]   Hot embossing as a method for the fabrication of polymer high aspect ratio structures [J].
Becker, H ;
Heim, U .
SENSORS AND ACTUATORS A-PHYSICAL, 2000, 83 (1-3) :130-135
[4]   Fabrication of large-core 1 x 16 optical power splitters in polymers using hot-embossing process [J].
Choi, CG ;
Han, SP ;
Kim, BC ;
Ahn, SH ;
Jeong, MY .
IEEE PHOTONICS TECHNOLOGY LETTERS, 2003, 15 (06) :825-827
[5]   Laser-fabricated low-loss single-mode raised-rib waveguiding devices in polymers [J].
Eldada, L ;
Xu, CZ ;
Stengel, KMT ;
Shacklette, LW ;
Yardley, JT .
JOURNAL OF LIGHTWAVE TECHNOLOGY, 1996, 14 (07) :1704-1713
[6]  
Hanemann T., 2000, POLYM NEWS, V25, P224
[7]   Hot embossing - The molding technique for plastic microstructures [J].
Heckele, M ;
Bacher, W ;
Muller, KD .
MICROSYSTEM TECHNOLOGIES, 1998, 4 (03) :122-124
[8]   Review on micro molding of thermoplastic polymers [J].
Heckele, M ;
Schomburg, WK .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2004, 14 (03) :R1-R14
[9]   Polymeric optical MEMS [J].
Hossfeld, J ;
Paatzsch, T ;
Schulze, J ;
Neumeier, M ;
Weber, L ;
Bauer, HD ;
Ehrfeld, W .
DESIGN, TEST, AND MICROFABRICATION OF MEMS AND MOEMS, PTS 1 AND 2, 1999, 3680 :637-645
[10]   FABRICATION OF LARGE-CORE, HIGH-DELTA OPTICAL WAVE-GUIDES IN POLYMERS [J].
KAGAMI, M ;
ITO, H ;
ICHIKAWA, T ;
KATO, S ;
MATSUDA, M ;
TAKAHASHI, N .
APPLIED OPTICS, 1995, 34 (06) :1041-1046