fiber grating lasers;
large spot lasers;
packaging;
semiconductor amplifiers;
D O I:
10.1109/2944.658799
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
This paper details how expanded-mode semiconductor devices and passive alignment techniques can be used to realize low-cost high-performance fiber grating laser and laser amplifier packages for future generations of optical telecommunication systems.