Creep behavior and deformation mechanism map of Sn-Pb eutectic solder alloy

被引：56
作者：
Shi, XQ
Wang, ZP
Yang, QJ
Pang, HLJ
机构：
[1] Gintic Inst Mfg Technol, Singapore 638075, Singapore
[2] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore
来源：
JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME | 2003年 / 125卷 / 01期
关键词：
D O I：
10.1115/1.1525254
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
In this study, a large number of creep tests were carried out using miniature specimens in order to investigate the creep behavior of 63Sn/37Pb eutectic solder alloy over a wide temperature range from -40 to 150degreesC and stress range from 0.75 to 70 MPa. Based on dislocation and diffusion theories, two unified constitutive models were developed to describe the dislocation-controlled and diffusion-controlled creep behaviors observed. It was found that the two models accurately predict the experimental data. A deformation mechanism map was established for this eutectic solder alloy in order to interpret the creep mechanism under different temperature and loading conditions.
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页码：81 / 88
页数：8
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