Improved electrical properties of Ge metal-oxide-semiconductor capacitors with high-k HfO2 gate dielectric by using La2O3 interlayer sputtered with/without N2 ambient

被引:27
作者
Xu, H. X. [1 ]
Xu, J. P. [1 ]
Li, C. X. [2 ]
Lai, P. T. [2 ]
机构
[1] Huazhong Univ Sci & Technol, Dept Elect Sci & Technol, Wuhan 430074, Peoples R China
[2] Univ Hong Kong, Dept Elect & Elect Engn, Hong Kong, Hong Kong, Peoples R China
基金
中国国家自然科学基金;
关键词
THERMAL-STABILITY; MOS CAPACITORS; GERMANIUM; FILMS; INTERFACE; PASSIVATION; DEVICES; STACKS; ANNEAL;
D O I
10.1063/1.3462301
中图分类号
O59 [应用物理学];
学科分类号
摘要
The electrical properties of n-Ge metal-oxide-semiconductor (MOS) capacitors with HfO2/LaON or HfO2 / La2O3 stacked gate dielectric (LaON or La2O3 as interlayer) are investigated. It is found that better electrical performances, including lower interface-state density, smaller gate leakage current, smaller capacitance equivalent thickness, larger k value, and negligible C-V frequency dispersion, can be achieved for the MOS device with LaON interlayer. The involved mechanism lies in that the LaON interlayer can effectively block the interdiffusions of Ge, O, and Hf, thus suppressing the growth of unstable GeOx interlayer and improving the dielectric/Ge interface quality. (C) 2010 American Institute of Physics. [doi: 10.1063/1.3462301]
引用
收藏
页数:3
相关论文
共 25 条
[1]   Si interlayer passivation on germanium MOS capacitors with high-κ dielectric and metal gate [J].
Bai, WP ;
Lu, N ;
Kwong, DL .
IEEE ELECTRON DEVICE LETTERS, 2005, 26 (06) :378-380
[2]   Materials and electrical characterization of molecular beam deposited CeO2 and CeO2/HfO2 bilayers on germanium [J].
Brunco, D. P. ;
Dimoulas, A. ;
Boukos, N. ;
Houssa, M. ;
Conard, T. ;
Martens, K. ;
Zhao, C. ;
Bellenger, F. ;
Caymax, M. ;
Meuris, M. ;
Heyns, M. M. .
JOURNAL OF APPLIED PHYSICS, 2007, 102 (02)
[3]   Ultrathin Al2O3 and HfO2 gate dielectrics on surface-nitrided Ge [J].
Chen, JJH ;
Bojarczuk, NA ;
Shang, HL ;
Copel, M ;
Hannon, JB ;
Karasinski, J ;
Preisler, E ;
Banerjee, SK ;
Guha, S .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2004, 51 (09) :1441-1447
[4]   Interface engineering for Ge metal-oxide-semiconductor devices [J].
Dimoulas, A. ;
Brunco, D. P. ;
Ferrari, S. ;
Seo, J. W. ;
Panayiotatos, Y. ;
Sotiropoulos, A. ;
Conard, T. ;
Caymax, M. ;
Spiga, S. ;
Fanciulli, M. ;
Dieker, Ch. ;
Evangelou, E. K. ;
Galata, S. ;
Houssa, M. ;
Heyns, M. M. .
THIN SOLID FILMS, 2007, 515 (16) :6337-6343
[5]  
Dimoulas A, 2006, NATO SCI SER II-MATH, V220, P237
[6]  
Dimoulas A, 2007, TOP APPL PHYS, V106, P379
[7]   Electrical characteristics of Ge/GeOx(N)/HfO2 gate stacks [J].
Houssa, M ;
De Jaeger, B ;
Delabie, A ;
Van Elshocht, S ;
Afanas'ev, VV ;
Autran, JL ;
Stesmans, A ;
Meuris, M ;
Heyns, MM .
JOURNAL OF NON-CRYSTALLINE SOLIDS, 2005, 351 (21-23) :1902-1905
[8]  
Iwai H, 2002, INTERNATIONAL ELECTRON DEVICES 2002 MEETING, TECHNICAL DIGEST, P625, DOI 10.1109/IEDM.2002.1175917
[9]   Thermal stability of lanthanum oxynitride ultrathin films deposited on silicon substrates [J].
Kawada, Nobuhito ;
Ito, Masahiko ;
Saito, Yoji .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2006, 45 (12) :9197-9199
[10]   Effects of Ti content and wet-N2 anneal on Ge MOS capacitors with HfTiO gate dielectric [J].
Li, C. X. ;
Zou, X. ;
Lai, P. T. ;
Xu, J. P. ;
Chan, C. L. .
MICROELECTRONICS RELIABILITY, 2008, 48 (04) :526-530