Thermal, mechanical and shape memory properties of shape memory epoxy resin

被引：161

作者：

Liu, Yuyan ^{[1
]}

Han, Chunmiao ^{[1
]}

Tan, Huifeng ^{[1
]}

Du, Xingwen ^{[1
]}

机构：

[1] Harbin Inst Technol, Harbin 150001, Peoples R China

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2010年 / 527卷 / 10-11期

关键词：

Shape memory epoxy; Shape memory property; Fold-deploy shape memory test; COMPOSITES;

D O I：

10.1016/j.msea.2009.12.014

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A series of shape memory epoxy resins (SMEPs) were prepared by epoxy and varying content of aromatic amine curing agent, for the purpose of application on space deployable structures. The thermal and mechanical properties of SMEPs were investigated by DSC, DMA and tensile test. Shape memory properties were also studied by an unusual method we called fold-deploy shape memory test. The effects of cross-linking density, recovery temperature and consecutive cycles on the shape memory properties were revealed through systematic variation of these factors. The results showed this series of SMEPs had high shape retention ratio (more than 99.5%) and shape recovery ratio (around 100%). Their T-g varied from 44.7 degrees C to 145.3 degrees C, users could choose as individual requirement. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：2510 / 2514

页数：5

共 21 条

[1] Electrical properties of carbon-containing epoxy compositions under shape memory effect realization [J].