A study of direct- and pulse-current chromium electroplating on rotating cylinder electrode (RCE)

被引:19
作者
Chang, J. H.
Hsu, F. Y.
Liao, M. J.
Huang, C. A. [1 ]
机构
[1] Chang Gung Univ, Dept Mech Engn, Tao Yuan 333, Taiwan
[2] Ming Chi Univ Technol, Dept Mat Engn, Taipei 243, Taiwan
关键词
chromium electroplating; rotating speed; RCE; TEM microstructure;
D O I
10.1016/j.apsusc.2007.01.124
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Direct- and pulse-current (DC and PC) chromium electroplating on Cr-Mo steel were performed in a sulfate-catalyzed chromic acid solution at 50 degrees C using a rotating cylinder electrode (RCE). The electroplating cathodic current densities were at 30, 40, 50 and 60 A dm(-2) , respectively. The relationship between electroplating current efficiency and the rotating speed of the RCE was studied. The cross-sectional microstructure of Crdeposit was examined by transmission electron microscope (TEM). Results showed that DC-plating exhibited higher current efficiency than the PC-plating under the same conditions of electroplating current density and the rotating speed. We found the critical rotating speed of RCE used in the chromium electroplating, above this rotating speed the chromium deposition is prohibited. At the same plating current density, the critical rotating speed for DC-plating was higher than that for PC-plating. The higher plating current density is, the larger difference in critical rotating speeds appears between DC- and PC-electroplating. Equiaxed grains, in a nanoscale size with lower dislocation density, nucleate on the cathodic surface in both DC- and PC-electroplating. Adjacent to the equiaxed grains, textured grains were found in other portion of chromium deposit. Fine columnar grains were observed in the DC-electroplated deposit. On the other hand, very long slender grains with high degree of preferred orientation were detected in PC-electroplated deposit. (c) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:6829 / 6834
页数:6
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