Diffusion Bonding between Zr-Based Metallic Glass and Copper

被引：0

作者：

Kou Hongchao ^{[1
]}

Guan Heng ^{[1
]}

Wang Jun ^{[1
]}

Tang Bin ^{[1
]}

Li Jinshan ^{[1
]}

机构：

[1] Northwestern Polytech Univ, State Key Lab Solidificat Proc, Xian 710072, Peoples R China

来源：

RARE METAL MATERIALS AND ENGINEERING | 2016年 / 45卷 / 01期

关键词：

diffusion bonding; metallic glass; interlayer; interface; ALUMINUM-ALLOY; IRRADIATION; CORROSION; STRENGTH; JOINTS;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The diffusion bonding capability between Zr41.25Ti13.75Cu12.5Ni10Be22.5 bulk metallic glass and pure Cu with and without interlayer was studied on a Gleeble3500 thermomechanical simulator. Experimental results show that good diffusion bonding joints without cracks and voids can be obtained under both conditions. Atomic diffusion at the interface is obviously observed using EDS and EPMA methods, while the diffusion zones are very narrow. The crystalline phases transformed from amorphous state will accelerate the atomic diffusion at the interface.

引用

页码：42 / 45

页数：4

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