The influence of thermal conductivity on segmented chip formation

被引：34

作者：

Bäker, M ^{[1
]}

Rösler, J ^{[1
]}

Siemers, C ^{[1
]}

机构：

[1] Tech Univ Braunschweig, Inst Werkstoffe, D-38106 Braunschweig, Germany

来源：

COMPUTATIONAL MATERIALS SCIENCE | 2003年 / 26卷

关键词：

machining; segmented chips; thermal conductivity; finite elements; remeshing;

D O I：

10.1016/S0927-0256(02)00396-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A two-dimensional finite element model of the machining process is presented. After a short discussion of the modelling technique and the remeshing algorithm used, the influence of thermal conductivity on the chip segmentation process is studied. Increasing thermal conductivity leads to a decreasing degree of segmentation and to an increase in the cutting force. The influence of the thermal conductivity on the width of the shear bands and on maximum temperatures is also discussed. (C) 2002 Elsevier Science B.V. All right reserved.

引用

页码：175 / 182

页数：8

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