In-plane phonon transport in thin films

被引:115
作者
Turney, J. E. [1 ]
McGaughey, A. J. H. [1 ]
Amon, C. H. [1 ,2 ]
机构
[1] Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
[2] Univ Toronto, Dept Mech & Ind Engn, Toronto, ON M5S 3G8, Canada
关键词
anharmonic lattice modes; argon; Boltzmann equation; elemental semiconductors; Lennard-Jones potential; molecular dynamics method; phonon-phonon interactions; phonons; quantum solids; semiconductor thin films; silicon; thermal conductivity; THERMAL-CONDUCTIVITY; HEAT-CONDUCTION; BOUNDARY SCATTERING; SILICON; DISPERSION; ORDER;
D O I
10.1063/1.3296394
中图分类号
O59 [应用物理学];
学科分类号
摘要
The in-plane phonon thermal conductivities of argon and silicon thin films are predicted from the Boltzmann transport equation under the relaxation time approximation. We model the thin films using bulk phonon properties obtained from harmonic and anharmonic lattice dynamics calculations. The input required for the lattice dynamics calculations is obtained from interatomic potentials: Lennard-Jones for argon and Stillinger-Weber for silicon. The effect of the boundaries is included by considering only phonons with wavelengths that fit within the film and adjusting the relaxation times to account for mode-dependent, diffuse boundary scattering. Our model does not rely on the isotropic approximation or any fitting parameters. For argon films thicker than 4.3 nm and silicon films thicker than 17.4 nm, the use of bulk phonon properties is found to be appropriate and the predicted reduction in the in-plane thermal conductivity is in good agreement with results obtained from molecular dynamics simulation and experiment. We include the effects of boundary scattering without employing the Matthiessen rule. We find that the Matthiessen rule yields thermal conductivity predictions that are at most 12% lower than our more accurate results. Our results show that the average of the bulk phonon mean free path is an inadequate metric to use when modeling the thermal conductivity reduction in thin films.
引用
收藏
页数:8
相关论文
共 49 条
  • [1] Ashcroft N., 2011, Solid State Physics
  • [2] Thermal conduction in doped single-crystal silicon films
    Asheghi, M
    Kurabayashi, K
    Kasnavi, R
    Goodson, KE
    [J]. JOURNAL OF APPLIED PHYSICS, 2002, 91 (08) : 5079 - 5088
  • [3] Phonon-boundary scattering in thin silicon layers
    Asheghi, M
    Leung, YK
    Wong, SS
    Goodson, KE
    [J]. APPLIED PHYSICS LETTERS, 1997, 71 (13) : 1798 - 1800
  • [4] Prediction of thermal conductivity of nanostructures: Influence of phonon dispersion approximation
    Baillis, D.
    Randrianalisoa, J.
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2009, 52 (11-12) : 2516 - 2527
  • [5] Thermal conductivity of suspended GaAs nanostructures: Theoretical study
    Barman, Saswati
    Srivastava, G. P.
    [J]. PHYSICAL REVIEW B, 2006, 73 (20)
  • [6] Aspects of thin-film superlattice thermoelectric materials, devices, and applications
    Böttner, H
    Chen, G
    Venkatasubramanian, R
    [J]. MRS BULLETIN, 2006, 31 (03) : 211 - 217
  • [7] Lattice thermal conductivity of silicon from empirical interatomic potentials
    Broido, DA
    Ward, A
    Mingo, N
    [J]. PHYSICAL REVIEW B, 2005, 72 (01)
  • [8] Nanoscale thermal transport
    Cahill, DG
    Ford, WK
    Goodson, KE
    Mahan, GD
    Majumdar, A
    Maris, HJ
    Merlin, R
    Phillpot, SR
    [J]. JOURNAL OF APPLIED PHYSICS, 2003, 93 (02) : 793 - 818
  • [9] An analytical model for the thermal conductivity of silicon nanostructures
    Chantrenne, P
    Barrat, JL
    Blase, X
    Gale, JD
    [J]. JOURNAL OF APPLIED PHYSICS, 2005, 97 (10)
  • [10] Chen G., 2003, ROHSENOW S FUTURE TR, P3