MEMS prototyping using RF sputtered films

被引:0
作者
Chandra, Sudhir
Bhatt, Vivekanand
Singh, Ravindra
Sharma, Preeti
Pal, Prem
机构
[1] Indian Inst Technol, Ctr Appl Res Elect, New Delhi 110016, India
[2] Yonsei Univ, Yonsei Microsyst Lab, Seoul 120749, South Korea
关键词
RF sputtering; dielectric films; piezoelectric films; perfect convex corner; MEMS microstructures;
D O I
暂无
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
In the present work, the deposition and characterization of dielectric, piezoelectric, semiconductor and conductor films by RF diode / RF magnetron sputtering process for applications in MEMS fabrication have been reported. Thin films of silicon dioxide, silicon nitride, amorphous silicon, zinc oxide and lanthanum doped lead zirconate titanate (PLZT) were prepared by RF sputtering process and extensively characterized for their structural, optical, and electrical properties. Thin films of conducting materials which are commonly used in MEMS fabrication (Cr, Au, Ti, and Pt) were also prepared by the same process. A few applications of these films in MEMS are demonstrated. It has been concluded that RF sputtering can be advantageously used for rapid prototyping of MEMS and demonstrating new ideas especially by researchers who do not have access to a well-established MEMS foundry.
引用
收藏
页码:326 / 331
页数:6
相关论文
共 13 条
[1]   JNK1 is required for maintenance of neuronal microtubules and controls phosphorylation of microtubule-associated proteins [J].
Chang, LF ;
Jones, Y ;
Ellisman, MH ;
Goldstein, LSB ;
Karin, M .
DEVELOPMENTAL CELL, 2003, 4 (04) :521-533
[2]  
MAISSEL L, 1970, HDB THIN FILM TECHNO, P15
[3]   Recessed microstructures with perfect convex corners for accelerometers [J].
Pal, P ;
Chandra, S .
SENSOR LETTERS, 2004, 2 (3-4) :226-231
[4]   RF sputtered silicon for MEMS [J].
Pal, P ;
Chandra, S .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2005, 15 (08) :1536-1546
[5]   A novel process for perfect convex corner realization in bulk micromachining [J].
Pal, P ;
Chandra, S .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2004, 14 (10) :1416-1420
[6]  
PREETI S, 2004, INT C SMART MAT CHIA, P331
[7]  
PREM P, 2004, SMART MATER STRUCT, V13, P1424
[8]  
PREM P, 2006, SENS LETT, V4, P1
[9]  
RAVINDRA S, 2005, INT WORKSH PHYS SEM
[10]  
RAVINDRA S, IN PRESS J MAT SCI