Microstructural analysis of diffusion bonding on copper stainless steel

被引:9
作者
Sebastian, Sanoop [1 ]
Suyamburajan, VijayAnanth [1 ]
机构
[1] VELS Inst Sci Technol & Adv Studies, Chennai, Tamil Nadu, India
关键词
Diffusion bonding; Microstructure analysis; Copper/stainless steel; SEM; Shear test;
D O I
10.1016/j.matpr.2020.07.244
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Diffusion bonding is one of the solid-state welding processes, were bonded through the diffusion welding method. The bonding was achieved by placing the specimens under a load of pressure 5 MPa nickel layer is used in between the material and the temperate range was taken between 700 and 900 degrees C. The findings suggested distinct diffusion were found in the different parameters. The results indicated the formation of separate diffusion zones at both Cu/Ni and Ni/SS interfaces during the diffusion bonding process. In both interfaces, the thickness required an increased inspection by rising the manufacturing temperature. The microstructure analysis also done on the diffusion boded joints with various parameters. (C) 2020 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1706 / 1712
页数:7
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