Sublimation growth of titanium nitride crystals

被引:11
作者
Du, Li [1 ]
Edgar, J. H. [1 ]
Kenik, Edward A. [2 ]
Meyer, Harry, III [2 ]
机构
[1] Kansas State Univ, Dept Chem Engn, Manhattan, KS 66506 USA
[2] Oak Ridge Natl Lab, High Temp Mat Lab, Oak Ridge, TN 37831 USA
关键词
TRANSPORT; CHEMISTRY; FILMS; TIN;
D O I
10.1007/s10854-009-9873-8
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The sublimation-recondensation growth of titanium nitride crystals with N/Ti ratio of 0.99 on tungsten substrates is reported. The growth rate dependence on temperature and pressure was determined, and the calculated activation energy was 775.8 +/- A 29.8 kJ/mol. The lateral and vertical growth rates changed with the time of growth and the fraction of the tungsten substrate surface covered. The orientation relationship of TiN (001) || W (001) with TiN [100] || W [110], a 45A degrees angle between TiN [100] and W [100], occurs not only for TiN crystals deposited on (001) textured tungsten but also for TiN crystals deposited on randomly orientated tungsten. This study demonstrates that this preferred orientational relationship minimizes the lattice mismatch between the TiN and tungsten.
引用
收藏
页码:78 / 87
页数:10
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