Millimeter Wave Wireless Link for On-board Chip to Chip Communication

被引：0

作者：

Jang, Tae Hwan ^{[1
]}

Jun, Seongbae ^{[1
]}

Kim, Seung Hun ^{[1
]}

Son, Hyuk Su ^{[2
]}

Kang, Dong Min ^{[1
]}

Park, Hyuncheol ^{[1
]}

Park, Chul Soon ^{[1
]}

机构：

[1] Korea Adv Inst Sci & Technol, Sch Elect Engn, Daejeon, South Korea

[2] Samsung Elect, LSI Dept, Suwon, South Korea

来源：

2019 WIRELESS DAYS (WD) | 2019年

基金：

新加坡国家研究基金会;

关键词：

120GHz; Chip to chip; Communication; Wireless; PA; antenna; LNA;

D O I：

10.1109/wd.2019.8734216

中图分类号：

TN [电子技术、通信技术];

学科分类号：

0809 ;

摘要：

In this work, a 120 GHz wireless link for on-board chip-to-chip communication is presented for the case of a 20 mm transmission distance. A Y-shaped antenna is used for wideband, on-board connection, and a PA-antenna-LNA link is measured to evaluate the performance of the channel. The proposed link shows a 3.2 dB peak gain and a 14 GHz, 4 dB gain bandwidth. The 50 Gbps data transmission simulation in the 16-QAM modulation format is carried out. Although the nonideal characteristics of the wireless link cause interference among symbols, the interference can be suppressed by the use of a linear equalizer. Further work on the transmission between transmitter and receiver will be performed.

引用

页数：2