Degradation Mechanism of Interfacial Adhesion between Screen-Printed Ag/Polyimide in Temperature/Humidity Environment

被引：4
作者：
Bae, Byung-Hyun [1 ]
Lee, Hyeonchul [2 ]
Kim, Gahui [3 ]
Son, Kirak [3 ]
Park, Young-Bae [3 ]
机构：
[1] VITZROTECH Co Ltd, 327 Byeolmang Ro, Ansan 15603, Gyeonggi Do, South Korea
[2] STATS ChipPAC Korea LTD, 191 Jayumuyeok Ro, Incheon 22379, South Korea
[3] Andong Natl Univ, Sch Mat Sci & Engn, 1375 Gyeongdong Ro, Andong Si 36729, Gyeongsangbuk D, South Korea
来源：
ELECTRONIC MATERIALS LETTERS | 2021年 / 17卷 / 02期
关键词：
Flexible printed circuit board; Peel test; Temperature; humidity; Screen-printed ag; Polyimide; ELECTROLESS-PLATED NI; AG NANOPARTICLES; SILVER; ENERGY; FILM; CONDUCTIVITY; LITHOGRAPHY; ALLOY; UV;
D O I：
10.1007/s13391-021-00272-1
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The effect of temperature/humidity (T/H) treatment at 85 celcius/85% relative humidity (R.H.) on the peel strength between screen-printed Ag/polyimide (PI) substrate was evaluated using a 180 degrees peel test. Initial peel strength was 22.22 +/- 1.00 gf/mm, and then decreased to 0.47 +/- 0.22 gf/mm after 500 h at 85 celcius/85% R.H. treatment condition. And, the peeled locus was changed from Ag/PI interface to mixed mode of Ag/PI interface and shallow cohesive inside PI near Ag/PI interface. The decrease in peel strength during T/H treatment is related to formation of weak boundary layer inside PI near Ag/PI interface by hydrolytic degradation of PI due to long-term moisture penetration into the Ag/PI interface.
引用
收藏
页码：157 / 163
页数：7
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