Degradation Mechanism of Interfacial Adhesion between Screen-Printed Ag/Polyimide in Temperature/Humidity Environment

被引：4

作者：

Bae, Byung-Hyun ^{[1
]}

Lee, Hyeonchul ^{[2
]}

Kim, Gahui ^{[3
]}

Son, Kirak ^{[3
]}

Park, Young-Bae ^{[3
]}

机构：

[1] VITZROTECH Co Ltd, 327 Byeolmang Ro, Ansan 15603, Gyeonggi Do, South Korea

[2] STATS ChipPAC Korea LTD, 191 Jayumuyeok Ro, Incheon 22379, South Korea

[3] Andong Natl Univ, Sch Mat Sci & Engn, 1375 Gyeongdong Ro, Andong Si 36729, Gyeongsangbuk D, South Korea

来源：

ELECTRONIC MATERIALS LETTERS | 2021年 / 17卷 / 02期

关键词：

Flexible printed circuit board; Peel test; Temperature; humidity; Screen-printed ag; Polyimide; ELECTROLESS-PLATED NI; AG NANOPARTICLES; SILVER; ENERGY; FILM; CONDUCTIVITY; LITHOGRAPHY; ALLOY; UV;

D O I：

10.1007/s13391-021-00272-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The effect of temperature/humidity (T/H) treatment at 85 celcius/85% relative humidity (R.H.) on the peel strength between screen-printed Ag/polyimide (PI) substrate was evaluated using a 180 degrees peel test. Initial peel strength was 22.22 +/- 1.00 gf/mm, and then decreased to 0.47 +/- 0.22 gf/mm after 500 h at 85 celcius/85% R.H. treatment condition. And, the peeled locus was changed from Ag/PI interface to mixed mode of Ag/PI interface and shallow cohesive inside PI near Ag/PI interface. The decrease in peel strength during T/H treatment is related to formation of weak boundary layer inside PI near Ag/PI interface by hydrolytic degradation of PI due to long-term moisture penetration into the Ag/PI interface.

引用

页码：157 / 163

页数：7

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