Modeling of spiral and meander lines in multilayer passive integration

被引：1
|
作者：
Kelander, I
Arslan, A
Hurskainen, V
机构：
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2002年
关键词：
D O I：
10.1109/EPEP.2002.1057888
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, we present design and modeling techniques for transmission line passive components integrated on multilayer LTCC package. We discuss and characterize spiral and meander type lines, which may enable considerable size and cost reduction of RF modules.
引用
收藏
页码：83 / 86
页数：4
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