Three-dimensional transient piezothermoelasticity in functionally graded rectangular plate bonded to a piezoelectric plate

被引:126
作者
Ootao, Y [1 ]
Tanigawa, Y [1 ]
机构
[1] Univ Osaka Prefecture, Dept Mech Syst Engn, Sakai, Osaka 5998531, Japan
关键词
elasticity; thermal stress; functionally graded material; piezoelectricity; rectangular plate; three-dimensional problem; transient state;
D O I
10.1016/S0020-7683(99)00257-7
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
摘要
In this study, the theoretical analysis of a three-dimensional transient piezothermoelasticity problem is developed for a functionally graded rectangular plate bonded to a piezoelectric plate due to partial heat supply. In this analysis, temperature distribution has a dependence on time, while the inertia term is ignored. Assuming the functionally graded rectangular plate has nonhomogeneous thermal and mechanical material properties in the thickness direction, the three-dimensional temperature in a transient state and three-dimensional transient thermal stresses of a simple supported plate for functionally graded material are analyzed by introducing the theory of laminated composites as a theoretical approximation. By using the solution for a functionally graded plate and the exact solution for piezoelectric plate of crystal class mm2, the theoretical analysis of three-dimensional transient piezothermoelasticity is developed for a simply supported combined plate. As an example, numerical calculations are carried out for a functionally graded rectangular plate made of zirconium oxide and titanium alloy, bonded to a piezoelectric plate of a cadmium selenide solid. Some numerical results for the temperature change, the displacement, the stress, electric potential, and electric displacement distributions in a transient state are shown in figures. (C) 2000 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:4377 / 4401
页数:25
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