Printed Circuit Board Modelling for Thermal Analysis of Electronics Packages

被引：1

作者：

Mahitkar, Jayesh ^{[1
]}

Chauhan, Mayank ^{[2
]}

Gediya, Hardik ^{[2
]}

Singh, Vivek K. ^{[2
]}

机构：

[1] PDPU, Dept Mech Engn, Gandhinagar 38242, Gujarat, India

[2] Indian Space Res Org, Space Applicat Ctr, Ahmadabad 380015, Gujarat, India

来源：

INNOVATIONS IN INFRASTRUCTURE | 2019年 / 757卷

关键词：

PCB; Thermal modelling; Electronics package; Thermal design;

D O I：

10.1007/978-981-13-1966-2_25

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Thermal design of electronics subsystems containing printed circuit boards (PCBs) for space applications is quite a challenging and time-consuming job due to lack of convective environment and no possibility of repair in case of failure once subsystem is launched in the mission. Thermal designer tries to reduce modelling and computational effort by modelling multilayer PCBs in equivalent lesser number of layers. This paper deals with case study of a typical electronics subsystems having one multilayered PCB thermal modelling. Two cases are considered for thermal analysis. In one case, all layers of PCB are modelled as they are and in second case multilayered PCB (10 layers) is modelled in two equivalent layers.

引用

页码：287 / 294

页数：8

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