Microstrip Power Combiners for V-Band Solid-State Power Amplifiers

被引：2

作者：

Roychowdhury, Debatrayee ^{[1
]}

Kitchen, Jennifer ^{[1
]}

机构：

[1] Arizona State Univ, Sch Elect Comp & Energy Engn, Tempe, AZ 85287 USA

来源：

PROCEEDINGS OF THE 2020 IEEE TEXAS SYMPOSIUM ON WIRELESS AND MICROWAVE CIRCUITS AND SYSTEMS (WMCS) | 2020年

关键词：

microstrip; power combiner; Gysel; Wilkinson; T-junction; V-band; solid-state power amplifier;

D O I：

10.1109/wmcs49442.2020.9172403

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper analyzes the most popular microstrip power combiners for output power combining in millimeter-wave solid-state power amplifiers (SSPAs). Wilkinson, Gysel, and T-junction power combiners are compared with respect to nominal insertion loss and isolation, as well as robustness to fabrication variations and varying termination impedances. This work also presents the design of an 8:1 Gysel microstrip power combiner for SSPAs at V band operating frequencies from 71-76 GHz. Full-wave electromagnetic simulation results for the designed 8:1 Gysel power combiner demonstrate a worst-case 8:1 combiner insertion loss of -2.7dB and worst-case isolation of -16.5dB. The 8:1 combiner consumes 16.8mm x 11.2mm of area.

引用

页数：5

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