Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn-3.0Ag-0.5Cu/Cu solder joints reinforced with Ni and Ni-Sn nanoparticles

被引：6

作者：

Yakymovych, Andriy ^{[1
,2
]}

Plevachuk, Yuriy ^{[3
]}

Orovcik, Lubomir ^{[4
]}

Svec, Peter, Sr. ^{[5
]}

机构：

[1] Dr Oswin Moro Srt 19, A-9500 Villach, Austria

[2] Univ Vienna, Fac Chem, Dept Inorgan Chem Funct Mat, Althanstr 14, A-1090 Vienna, Austria

[3] Ivan Franko Natl Univ Lviv, Dept Met Phys, Kyrylo & Mefodiy St 8, UA-79005 Lvov, Ukraine

[4] Slovak Acad Sci, Inst Mat & Machine Mech, Dubravska Cesta 9, Bratislava 84513, Slovakia

[5] Slovak Acad Sci, Inst Phys, Dubravska Cesta 9, Bratislava 84511, Slovakia

来源：

APPLIED NANOSCIENCE | 2022年 / 12卷 / 04期

基金：

奥地利科学基金会;

关键词：

Metal nanoparticles; SAC305; solder; Microstructure; Thermal treatment; MICROSTRUCTURE;

D O I：

10.1007/s13204-021-01750-6

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The concept of nanocomposite lead-free solders has provided a promising approach to improve mechanical reliability of solder joints. Minor additions of metal nanoparticles into the commonly used Sn-3.0Ag-0.5Cu solder impact on the morphology of both the solder alloy and solder/Cu joint. For instance, it was stated that the average thickness of the interfacial intermetallic compound layer between Sn-3.0Ag-0.5Cu solder and Cu substrate decreases by addition up to 2.0wt.% of nano-sized Ni and Ni-Sn particles. The present research is the follow-up of our previous study and is focused on the investigations of the thermal aged Sn-3.0Ag-0.5Cu solder joints with up to 2.0wt.% of nano-sized Ni, Ni3Sn and Ni3Sn2 inclusions. The produced Cu/nanocomposite solder/Cu joints were kept at the temperature of 423 K for 10 and 20 days. Based on the average thickness of the interfacial intermetallic compound layer Cu6Sn5/Cu3Sn estimated for solder joints with different aging time, the growth kinetics of the interfacial IMC layer was examined.

引用

页码：977 / 982

页数：6

共 19 条

[1]

Akhtar AMZ, 2015, REV EFFECT NICKEL DO, P16

[2] Hybrid solder joints: morphology and shear strength of Sn-3.0Ag-0.5Cu solder joints by adding ceramic nanoparticles through flux doping [J].

Aspalter, A. ;

Cerny, A. ;

Goeschl, M. ;

Podsednik, M. ;

Khatibi, G. ;

Yakymovych, A. ;

Plevachuk, Yu .

APPLIED NANOSCIENCE, 2020, 10 (12) :4943-4949

[3] Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects [J].

Chia, Pay Ying ;

Haseeb, A. S. M. A. ;

Mannan, Samjid Hassan .

MATERIALS, 2016, 9 (06)

[4]

Coyle RJ, 2020, LEAD FREE SOLDERING, P191, DOI [10.1002/9781119482093.ch7, DOI 10.1002/9781119482093.CH7]

[5] Effects of Ni nanoparticles addition on the microstructure, electrical and mechanical properties of Sn-Ag-Cu alloy [J].

Gain, Asit Kumar ;

Zhang, Liangchi .

MATERIALIA, 2019, 5

[6] Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems [J].

Giuranno, Donatella ;

Delsante, Simona ;

Borzone, Gabriella ;

Novakovic, Rada .

JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 689 :918-930

[7] Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates [J].

Li, Shengli ;

Liu, Yang ;

Zhang, Hao ;

Cai, Hongming ;

Sun, Fenglian ;

Zhang, Guoqi .

RESULTS IN PHYSICS, 2018, 11 :617-622

[8]

MacDermid, 2020, ALPHA INN MACDERMID

[9] Interfacial reactions in the Sb-Sn/(Cu, Ni) systems: Wetting experiments [J].

Novakovic, R. ;

Lanata, T. ;

Delsante, S. ;

Borzone, G. .

MATERIALS CHEMISTRY AND PHYSICS, 2012, 137 (02) :458-465

[10]

Plevachuk Y, 2019, 2019 IEEE 2ND UKRAINE CONFERENCE ON ELECTRICAL AND COMPUTER ENGINEERING (UKRCON-2019), P722, DOI 10.1109/UKRCON.2019.8879891

← 1 2 →