A Novel All-in-One Digital-Analog Heterogeneous Integrated Intelligent Power Module

被引：0
|
作者：
Lin, Y. T. [1 ]
Kao, K. S. [1 ]
Tzeng, C. M. [1 ]
Lin, H. H. [1 ]
Han, W. K. [1 ]
Chang, J. Y. [1 ]
Chang, T. C. [1 ]
机构：
[1] Ind Technol Res Inst, Elect & Optoelect Syst Res Labs, Bldg 14,195,Sec 4,Chung Hsing Rd, Hsinchu 31040, Taiwan
来源：
2019 31ST INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD) | 2019年
关键词：
SiP; heterogeneous integration; IPM; EMC; power density;
D O I：
10.1109/ispsd.2019.8757581
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper introduces a novel all-in-one digital-analog heterogeneous integrated intelligent power module (IPM) which is composed of Si MOSFETs, Gate Driver and Micro Controller Unit (MCU). This novel all-in-one module realized by heterogeneous integration offers a System in Package (SiP) solution without causing serious Electromagnetic Compatibility (EMC), signal integrity and thermal issues. In addition, we designed the three-phase half-bridge inverter system formed by this IPM to compare with the system consisting of the same circuit and same bare dies of MOSFETs (TO-package), Gate Driver and MCU (SO-package). The performance shows that the inverter system which adopted this intelligent power module is capable of reducing system energy consumption, enhancing system efficiency (2-4%), and successfully shrinking system volume(>33%) at the same time. Besides, this SiP IPM can improve system reliability, electromagnetic compatibility (EMC) performance and pass the international standard of CISPR 11.
引用
收藏
页码：239 / 242
页数：4
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