Electrical resistance anomalies during electromigration testing of Cu conductor lines: Examples of local melting?

被引：0

作者：

Zhang, Hongqing ^{[1
]}

Wang, Gan ^{[1
]}

Cargill, G. S., III ^{[1
]}

机构：

[1] Lehigh Univ, Mat Sci & Engn, 5 E Packer Ave, Bethlehem, PA 18015 USA

来源：

MATERIALS, TECHNOLOGY AND RELIABILITY OF LOW-K DIELECTRICS AND COPPER INTERCONNECTS | 2006年 / 914卷

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D O I：

暂无

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

We have measured the resistance changes during electromigration (EM) testing of damascene Cu conductor lines with TaN liners and W vias. During EM, we observed an abrupt resistance increase, followed by a sudden resistance decrease, to values close to before the start of EM. Microstructural observations and thermal calculations suggest that the resistance decrease results from sudden, local Joule heating and melting of conductor line segments, and voids being partially filled by the back-flowing liquid Cu, which then solidifies.

引用

页码：339 / +

页数：2