Laser electrospray printing of nanoparticles on flexible and rigid substrates

被引：17

作者：

Castillo-Orozco, Eduardo ^{[1
,2
]}

Kumar, Ranganathan ^{[1
]}

Kar, Aravinda ^{[3
]}

机构：

[1] Univ Cent Florida, Dept Mech & Aerosp Engn, Orlando, FL 32816 USA

[2] Escuela Super Politecn Litoral, Fac Ingn Mecan & Ciencias Prod, ESPOL, Campus Gustavo Galindo,Km 30-5 Via Perimetral, Guayaquil, Ecuador

[3] Univ Cent Florida, CREOL, Coll Opt & Photon, Orlando, FL 32816 USA

来源：

JOURNAL OF LASER APPLICATIONS | 2019年 / 31卷 / 02期

基金：

美国国家科学基金会;

关键词：

electrospray; laser sintering; nanoparticle deposition; RHEOLOGY;

D O I：

10.2351/1.5079733

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Semiconductor and metal nanoparticles are known to possess excellent mechanical, electrical, and optical properties, but harnessing those novel properties for practical applications is impeded by the difficulty in depositing the nanoparticles into large two-dimensional thin films or three-dimensional structures. A new laser-assisted manufacturing process is developed for patterning and sintering nanoparticles to deposit semiconductor and conductor thin films. This technique has the ability to deposit various materials on rigid and flexible substrates such as paper and plastics for manufacturing flexible electronics.

引用

页数：6

共 36 条

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