A system design of liquid cooling computer based on the micro cooling technology

被引:0
|
作者
Chang, Jae-Young [1 ]
Park, Hee Sung [2 ]
Jo, Jong In [2 ]
Julia, Smironva [1 ]
机构
[1] Samsung Elect Co Ltd, Comp Syst Div, 416 Maetan Dong, Suwon 442742, Gyeonggi Do, South Korea
[2] Samsung Elect Co Ltd, Digital Media R&D Ctr, Suwon 442742, South Korea
来源
2006 PROCEEDINGS 10TH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONICS SYSTEMS, VOLS 1 AND 2 | 2006年
关键词
liquid cooling; microchannel;
D O I
暂无
中图分类号
O414.1 [热力学];
学科分类号
摘要
The high speed of data processing with quiet operation is an on-going issue for computer business industries. The demand for quiet operating computers shows the conventional cooling technology limit for high CPU power. A few alternative cooling technologies have been proposed to pass the limit with a lower acoustic noise emission. In this paper, we introduce a design approach for a liquid cooling system, one of the most promising alternative cooling technologies. The liquid cooling system consists of a microchannel heat sink, liquid pump, and heat rejecter for personal computer applications with high CPU power. The cooling performance of the liquid cooling system is predicted by using numerical calculations, which is compared with experimental results. The thermal resistance of the microchannel heat sink with a hydraulic diameter of 680 pin is 0.1 K/W from chip surface to fluid. The liquid pump provides backpressure and flow rate of 10 kPa and 400 mL/min respectively, using de-ionized water as working fluid. The beat rejecter is a plate-fin type exchanger having triangular cross sectional shape with a 120 mm diameter fall. Total thermal resistance of the liquid cooling system is evaluated as 0.23 K/W from chip surface to ambient.
引用
收藏
页码:157 / +
页数:2
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