In situ fabrication of photocurable conductive adhesives with silver nano-particles in the absence of capping agent

To increase electrical conductivity and reduce number of processes, this paper aims to fabricate in situ photocurable conductive adhesives with Ag nano-particles in the absence of polymeric protector. The mixture of epoxy-acrylic resin and reactive monomer, as well as AgNO3 in ethylene glycol, is irradiated by UV light to form silver nano-particles without capping agent and was followed by adding photoinitiator to produce photocurable adhesive with silver nano-particles. In particular, as measured by transmission electron microscopy, the diameter of Ag nano-particle is 30-50 nm for 1 M and 80-90 nm for 2 and 3 M of AgNO3, in ethylene glycol. Furthermore, taking 1:1 weight ratio of photosensitive mixture to 3 M of AgNO3 in ethylene glycol as an example, the surface electrical resistivity of photocurable conductive adhesive may be reduced to 8.803 x 10(6) (Omega/square) after exposing to 900 mJ/cm(2). (c) 2006 Elsevier Ltd. All rights reserved.