Advanced Color Filter Isolation Technology for Sub-Micron Pixel of CMOS Image Sensor

被引：3

作者：

Bak, Hojin ^{[1
]}

Lee, Horyeong ^{[1
]}

Kim, Won-Jin ^{[1
]}

Choi, Inho ^{[1
]}

Kim, Hanjun ^{[1
]}

Kim, Dongha ^{[1
]}

Lee, Hanseung ^{[1
]}

Han, Sukman ^{[1
]}

Lee, Kyoung-In ^{[1
]}

Do, Youngwoong ^{[1
]}

Cho, Minsu ^{[1
]}

Baek, Moung-Seok ^{[1
]}

Kim, Kyungdo ^{[1
]}

Park, Wonje ^{[1
]}

Kang, Seong-Hun ^{[1
]}

Hong, Sung-Joo ^{[1
]}

Oh, Hoon-Sang ^{[1
]}

Song, Changrock ^{[1
]}

机构：

[1] SK Hynix Inc, Icheon, Gyeonggi Do, South Korea

来源：

2022 INTERNATIONAL ELECTRON DEVICES MEETING, IEDM | 2022年

关键词：

D O I：

10.1109/IEDM45625.2022.10019484

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work, novel color filter isolation technology, which adopts air, the lowest refractive index material on the earth, as a major component of an optical grid structure for sub-micron pixels of a CMOS image sensor, is presented. Metal in a conventional metal grid structure, which has been widely used for mobile CMOS image sensors, was replaced by the air. The image quality improvement was verified through the enhanced optical performance of the air- grid-assisted pixels.

引用

页数：4

共 6 条

[1] Crosstalk and microlens study in a color CMOS image sensor [J].

Agranov, G ;

Berezin, V ;

Tsai, RH .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 2003, 50 (01) :4-11

[2]

Joe I. -S., 2021, PROC S VLSI CIRCUITS, P1, DOI [10.23919/VLSICircuits52068.2021. 9492339, DOI 10.23919/VLSICIRCUITS52068.2021.9492339]

[3] 1/2.74-inch 32Mpixel-Prototype CMOS Image Sensor with 0.64μm Unit Pixels Separated by Full-Depth Deep-Trench Isolation [J].

Park, JongEun ;

Park, Sungbong ;

Cho, Kwansik ;

Lee, Taehun ;

Lee, Changkyu ;

Kim, DongHyun ;

Lee, Beomsuk ;

Kim, Sungln ;

Ji, Ho-Chul ;

Im, DongMo ;

Park, Haeyong ;

Kim, Jinyoung ;

Cha, JungHo ;

Kim, Taehoon ;

Joe, In-Sung ;

Hong, Soojin ;

Chang, Chongkwang ;

Kim, Jingyun ;

Shim, WooGwan ;

Kim, Taehee ;

Lee, Jamie ;

Park, Donghyuk ;

Kim, EuiYeol ;

Park, Howoo ;

Lee, Jaekyu ;

Kim, Yitae ;

Ahn, FJungChak ;

Hong, YoungKi ;

Jun, ChungSam ;

Kim, Hyunchul ;

Moon, Chang-Rok ;

Kang, Ho-Kyu .

2021 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC), 2021, 64 :122-+

[4]

Park S., 2022, IEEE INT SOLID STATE, V65, P1

[5] Cost-effective wideband dielectric planar lens antenna for millimeter wave applications [J].

Poyanco, Jose-Manuel ;

Pizarro, Francisco ;

Rajo-Iglesias, Eva .

SCIENTIFIC REPORTS, 2022, 12 (01)

[6] Second Generation Small Pixel Technology Using Hybrid Bond Stacking [J].

Venezia, Vincent C. ;

Hsiung, Alan Chih-Wei ;

Yang, Wu-Zang ;

Zhang, Yuying ;

Zhao, Cheng ;

Lin, Zhiqiang ;

Grant, Lindsay A. .

SENSORS, 2018, 18 (02)

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