Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers

被引：1

作者：

Malik, Muhammad Hassan ^{[1
,2
]}

Rauter, Lukas ^{[1
,2
]}

Zangl, Hubert ^{[2
,3
]}

Binder, Alfred ^{[1
]}

Roshanghias, Ali ^{[1
]}

机构：

[1] Silicon Austria Labs GmbH, Europastr 12, A-9524 Villach, Austria

[2] Alpen Adria Univ Klagenfurt, Inst Smart Syst Technol, A-9020 Klagenfurt, Austria

[3] AAU SAL USE Lab, A-9020 Klagenfurt, Austria

来源：

2022 IEEE INTERNATIONAL CONFERENCE ON FLEXIBLE AND PRINTABLE SENSORS AND SYSTEMS (IEEE FLEPS 2022) | 2022年

基金：

欧盟地平线“2020”;

关键词：

E-papers; Ultra-thin dies; Hybrid integration; Flip Chip; Anisotropic Conductive Film (ACP); Inkjet Printing; Dynamic bending test;

D O I：

10.1109/FLEPS53764.2022.9781561

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Paper as a substrate for electronic circuits with inkjet printing of conductors and insulators offers advantages such as low-cost, flexibility, eco-friendliness, and recyclability. To realize circuitry on papers, inkjet printing is one of the standard methodologies. However, heterogeneous integration of components on inkjet printed papers has faced reliability issues; therefore, inkjet printing is still not the mainstream in the fabrication of electronic papers (E-papers). Accordingly, in this study, the feasibility and reliability of integrating ultra-thin chips (UTC) on inkjet printed papers were discussed and analyzed. The significant effects of printed layer thickness on both electrical performance and long-term stability of the E-papers were demonstrated. The results were also compared to screen-printed papers.

引用

页数：4

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