Sensors and packages based on LTCC and thick-film technology for severe conditions

被引:17
作者
Jacq, C. [1 ]
Maeder, Th [1 ]
Ryser, P. [1 ]
机构
[1] Ecole Polytech Fed Lausanne, Lab Prod Microtech, CH-1015 Lausanne, Switzerland
来源
SADHANA-ACADEMY PROCEEDINGS IN ENGINEERING SCIENCES | 2009年 / 34卷 / 04期
关键词
Thick-film materials; LTCC; harsh environments; sensors; packaging; FABRICATION;
D O I
10.1007/s12046-009-0031-z
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Reliable operation in harsh environments such as high temperatures, high pressures, aggressive media and space, poses special requirements for sensors and packages, which usually cannot be met using polymer-based technologies. Ceramic technologies, especially LTCC (Low-Temperature Cofired Ceramic), offer a reliable platform to build hermetic, highly stable and reliable sensors and packages. This is illustrated in the present work through several such devices. The examples are discussed in terms of performance, reliability, manufacturability and cost issues.
引用
收藏
页码:677 / 687
页数:11
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