Mechanical properties of Ag-Ni seal rings for micro-systems

被引：0
|
作者：
Sharma, R. P. [1 ]
Khanna, P. K.
Kumar, D. [1 ]
机构：
[1] Kurukshetra Univ, Dept Elect Sci, Kurukshetra 136119, Haryana, India
来源：
OPTOELECTRONICS AND ADVANCED MATERIALS-RAPID COMMUNICATIONS | 2009年 / 3卷 / 12期
关键词：
Isothermal solidification; Seal ring; Ultimate shear strength (USS); Ultimate tensile strength (UTS) and ultimate torsional strength;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Fabrication of mechanically stable interconnections on chip and micro-systems, applicable in hazardous environment, is the main objective of the device packaging techniques. Isothermal solidification based interconnection technique offers possibility of obtaining high mechanical stability of bonding. Seal rings, commonly fabricated at input opening of sensors, are developed using Sri interlayer metal. Effects of temperature, reaction time, pressure, thickness and geometry on the ultimate tensile strength (UTS), ultimate shear strength (USS) and ultimate torsional strength values are analyzed and reported.
引用
收藏
页码：1375 / 1378
页数：4
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