Three-dimensional micro self-assembly using bridging flocculation

被引：16

作者：

Nakakubo, T ^{[1
]}

Shimoyama, I ^{[1
]}

机构：

[1] Univ Tokyo, Dept Mechanoinformat, Bunkyo Ku, Tokyo 1138656, Japan

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 2000年 / 83卷 / 1-3期

基金：

日本学术振兴会;

关键词：

self-assembly; self-organization; three dimensions; MEMS; flocculation;

D O I：

10.1016/S0924-4247(00)00355-1

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes three-dimensional (3D) self-assembling microstructures. Bridging flocculation of PAAM (polyacrylamide) is used as a bonding force. The microstructures are made of Si. An Al2O3 layer is deposited on a part of the surfaces for connection. By controlling the pH of the system, the bonding force acts only between the surfaces of Si and Al3O3. Therefore, the convex area can be connected to the concave one when they collide. These structures are fabricated mainly by oxidation and KOH anisotropic etching. We also demonstrate that the behavior of the self-assembling system can be described by chemical formulae and analyzed by rate equations. (C) 2000 Elsevier Science S.A. All rights reserved.

引用

页码：161 / 166

页数：6

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