Resistive random access memory characteristics of NiO thin films with an oxygen-deficient NiO0.95 layer

被引:24
作者
Ahn, Yoonho [1 ]
Son, Jong Yeog [2 ,3 ]
机构
[1] Korea Univ Technol & Educ, Sch Liberal Arts, Cheonan 31253, South Korea
[2] Kyung Hee Univ, Dept Appl Phys, Yongin 17104, South Korea
[3] Kyung Hee Univ, Inst Nat Sci, Yongin 17104, South Korea
基金
新加坡国家研究基金会;
关键词
Resistive random access memory; NiO thin Film; Oxygen-deficient layer; Conducting filament; Forming voltage; SET/RESET voltage; RRAM;
D O I
10.1016/j.ceramint.2020.12.064
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Herein, we characterize resistive random access memory (RRAM) devices containing an oxygen-deficient layer. The RRAM devices consist of multiple layered NiO thin films that consist of an oxygen-deficient NiO0.95 layer, within a NiO/NiO0.95/NiO layer structure. The NiO thin-film layers were deposited on Pt/Ta/SiO2/Si substrates by radio frequency magnetron sputtering. The stoichiometry and thickness of the NiO triple-layer thin films were determined by Auger electron spectroscopy. We fabricated RRAM capacitors with a structure of Pt/NiO/NiO0.95/NiO/Pt to investigate the resistive switching characteristics. The presence of an oxygen-deficient layer significantly lowers the forming and SET/RESET voltages compared to a Pt/NiO/Pt RRAM capacitor. This reduces the energy required to form conducting filaments in the oxygen-deficient layer. Moreover, the forming and SET/RESET voltages exhibit reduced dispersion due to the relatively high oxygen vacancy density in the oxygen-deficient NiO0.95 layer.
引用
收藏
页码:9342 / 9346
页数:5
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