Microstructure and thermal expansion of Ti coated diamond/Al composites

被引：33

作者：

Yang Bo ^{[1
]}

Yu Jia-kang ^{[1
]}

Chen Chuang ^{[1
]}

机构：

[1] NW Polytech Univ, State Key Lab Solidificat Proc, Xian 710072, Peoples R China

来源：

TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA | 2009年 / 19卷 / 05期

基金：

中国国家自然科学基金;

关键词：

composites; coating; diamond; infiltration; coefficient of thermal expansion; METAL-MATRIX COMPOSITES; CONDUCTIVITY; MANAGEMENT;

D O I：

10.1016/S1003-6326(08)60423-9

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

A titanium coating fabricated via vacuum vapor deposition for diamond/Al composites was used to improve the interfacial bonding strength between diamond particles and Al matrix, and the Ti coated diamond particles reinforced Al matrix composites were prepared by gas pressure infiltration for electronic packaging. The surface structure of the Ti coated diamond particles was investigated by XRD and SEM. The interfacial characteristics and fracture surfaces were observed by SEM and EDS. The coefficient of thermal expansion(CTE) of 50% (volume fraction) Ti coated diamond particles reinforced Al matrix composites was measured. The Ti coating on diamond before infiltration consists of inner TiC layer and outer TiO2 layer, and the inner TiC layer is very stable and cannot be removed during infiltration process. Fractographs of the composites illustrate that aluminum matrix fracture is the dominant fracture mechanism, and the stepped breakage of a diamond particle indicates strong interfacial bonding between the Ti coated diamond particles and the Al matrix. The measured low CTEs (5.07 X 10(-6)-9.27 X 10(-6) K-1) of the composites also show the strong interfacial bonding between the Ti coated diamond particles and the Al matrix.

引用

页码：1167 / 1173

页数：7

共 17 条

[1] Critical aspects of high-performance microprocessor packaging [J].

Atluri, VP ;

Mahajan, RV ;

Patel, PR ;

Mallik, D ;

Tang, J ;

Wakharkar, VS ;

Chrysler, GM ;

Chiu, CP ;

Choksi, GN ;

Viswanath, RS .

MRS BULLETIN, 2003, 28 (01) :21-34

[2] Interface formation in infiltrated Al(Si)/diamond composites [J].

Beffort, O. ;

Khalid, F. A. ;

Weber, L. ;

Ruch, P. ;

Klotz, U. E. ;

Meier, S. ;

Kleiner, S. .

[3] Materials for thermal conduction [J].

Chung, DDL .

APPLIED THERMAL ENGINEERING, 2001, 21 (16) :1593-1605

[4] Optical, thermal and mechanical properties of CVD diamond [J].

Coe, SE ;

Sussmann, RS .

[5]

DELANNAY F, 2007, COMPREHENSIVE COMPOS, P341

[6] Advances in thermal management materials for electronic applications [J].

Jin, SH .

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1998, 50 (06) :46-46

[7] DIAMOND/AL METAL-MATRIX COMPOSITES FORMED BY THE PRESSURELESS METAL INFILTRATION PROCESS [J].

JOHNSON, WB ;

SONUPARLAK, B .

JOURNAL OF MATERIALS RESEARCH, 1993, 8 (05) :1169-1173

[8] Effect of diamond crystallographic orientation on dissolution and carbide formation in contact with liquid aluminium [J].

Kleiner, S. ;

Khalid, F. A. ;

Ruch, P. W. ;

Meier, S. ;

Beffort, O. .

SCRIPTA MATERIALIA, 2006, 55 (04) :291-294

[9]

QIN YX, 2006, MATER LETT, V50, P2339

[10]

QIN ZK, 2005, T NONFERR METAL SOC, V15, P321

← 1 2 →