Integrating copper at the nanometer length scale with Sn-3.5Ag solder to develop high performance nanocomposites

被引：4

作者：

Babaghorbani, P. ^{[1
]}

Nai, S. M. L. ^{[2
]}

Gupta, M. ^{[1
]}

机构：

[1] Natl Univ Singapore, Dept Mech Engn, Div Mat, Singapore 117576, Singapore

[2] Natl Univ Singapore, Met & Mat Technol Ctr, Singapore 117576, Singapore

来源：

MATERIALS SCIENCE AND TECHNOLOGY | 2009年 / 25卷 / 10期

关键词：

Lead-free solder; Metal matrix nanocomposites; Mechanical behaviour; Microwave sintering; LEAD-FREE SOLDER; METAL-MATRIX COMPOSITES; MECHANICAL-PROPERTIES; REINFORCED ALUMINUM; TENSILE PROPERTIES; CARBON NANOTUBES; MICROWAVE; MAGNESIUM; STRENGTH; TEMPERATURE;

D O I：

10.1179/174328408X378582

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In the present study, copper at the nanometer length scale is integrated with Sn-3.5Ag using the technique of powder metallurgy incorporating energy efficient microwave sintering. Superior mechanical characteristics were realised for the formulations containing nanometer length scale copper in excess of 1 vol.-%. Sn-3.5Ag reinforced with 2.5 vol.% nanosize copper particulates exhibited the best overall mechanical characteristics. Particular emphasis is placed on studying the effect of the increasing presence of nanosize copper particulates on the microstructure and property evolution of the Sn-3.5Ag matrix.

引用

页码：1258 / 1264

页数：7

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