Dual-phase-lagging heat conduction and associated thermal shock fracture of sandwich composite plates

被引：15

作者：

Guo, S. L. ^{[1
]}

Wang, K. F. ^{[2
]}

Wang, B. L. ^{[2
,3
]}

机构：

[1] Qingdao Univ Technol, Sch Civil Engn, Qingdao 266033, Shandong, Peoples R China

[2] Harbin Inst Technol, Grad Sch Shenzhen, Harbin 150001, Heilongjiang, Peoples R China

[3] Western Sydney Univ, Ctr Infrastruct Engn, Sch Comp Engn & Math, Penrith, NSW 2751, Australia

来源：

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | 2019年 / 139卷

基金：

中国国家自然科学基金;

关键词：

Thermal shock fracture; Dual-phase-lag heat conduction; Sandwich composite plate; Penny-shaped crack; PENNY-SHAPED CRACK; HIGH-TEMPERATURE CERAMICS; NUMERICAL INVERSION; INTERFACE CRACK; RESISTANCE; PROPAGATION; LEQUATION; INERTIA; STRESS; LAYER;

D O I：

10.1016/j.ijheatmasstransfer.2019.04.081

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This paper studies a penny-shaped crack at the middle of a symmetric sandwich structure and is under a sudden temperature gradient on the crack faces. The temperature field of the structure and the stress intensity factor (SIF) at the crack tip are derived based on the dual-phase-lag non-Fourier heat conduction theory. Two specific factors are identified to predict the coupling effects of the thermal property differences between the skin and the core (including the differences in thermal conductivity, thermal diffusivity, heat flux lag and temperature gradient lag) on the thermoelastic behavior. If the coefficient of thermal expansion (COTE) of the skins is greater than that of the core, the peak value of transient SIF increases. If the CoTE of the skins is smaller than that of the core, the transient SIF is scarcely influenced. The results are useful for the designs and applications of sandwich structures work under thermal shock. (C) 2019 Elsevier Ltd. All rights reserved.

引用

页码：317 / 329

页数：13

共 44 条

[31] VERNOTTE P, 1958, CR HEBD ACAD SCI, V246, P3154
[32] Thermal shock fracture mechanics analysis of a semi-infinite medium based on the dual-phase-lag heat conduction model
Wang, B.
Li, J. E.
Yang, C.
[J]. PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES, 2015, 471 (2174):
[33] Thermal shock resistance of solids associated with hyperbolic heat conduction theory
Wang, B. L.
Li, J. E.
[J]. PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES, 2013, 469 (2153):
[34] Hyperbolic heat conduction and associated transient thermal fracture for a piezoelectric material layer
Wang, B. L.
Li, J. E.
[J]. INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2013, 50 (09) : 1415 - 1424
[35] Non-Fourier heat conduction in layered composite materials with an interface crack
Wang, B. L.
Han, J. C.
[J]. INTERNATIONAL JOURNAL OF ENGINEERING SCIENCE, 2012, 55 : 66 - 75
[36] Meshless approach for thermo-mechanical analysis of functionally graded materials
Wang, Hui
Qin, Qing-Hua
[J]. ENGINEERING ANALYSIS WITH BOUNDARY ELEMENTS, 2008, 32 (09) : 704 - 712
[37] Three-dimensional thermal weight function method for the interface crack problems in bimaterial structures under a transient thermal loading
Wu, Huaping
Li, Long
Chai, Guozhong
Song, Fan
Kitamura, Takayuki
[J]. JOURNAL OF THERMAL STRESSES, 2016, 39 (04) : 371 - 385
[38] An analytical solution for static analysis of a simply supported moderately thick sandwich piezoelectric plate
Wu, LH
Jiang, ZQ
Feng, WJ
[J]. STRUCTURAL ENGINEERING AND MECHANICS, 2004, 17 (05) : 641 - 654
[39] Xu YS, 1996, ACTA MECH SINICA, V12, P39, DOI 10.1007/BF02486760
[40] THERMAL-MECHANICAL COUPLING PROPAGATION AND TRANSIENT THERMAL FRACTURE IN MULTILAYER COATINGS
Zhang, Long
Zhang, Xiaomin
Peng, Song
Yan, Zimin
Liang, Yuan
Yan, Bo
Li, Qibin
[J]. HEAT TRANSFER RESEARCH, 2017, 48 (10) : 935 - 954

← 1 2 3 4 5 →