Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

被引：42

作者：

Berthou, M. ^{[1
,2
,3
]}

Retailleau, P. ^{[2
]}

Fremont, H. ^{[1
]}

Guedon-Gracia, A. ^{[1
]}

Jephos-Davennel, C. ^{[3
]}

机构：

[1] Univ Bordeaux 1, IMS Bordeaux, UMR 5218, F-33405 Talence, France

[2] MBDA France, F-92358 Le Plessis Robinson, France

[3] CELAR, DGA, F-35998 Rennes Armees, France

来源：

MICROELECTRONICS RELIABILITY | 2009年 / 49卷 / 9-11期

关键词：

D O I：

10.1016/j.microrel.2009.07.040

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes a reliable and reproducible method to reveal the microstructure of lead-free solder joints. This method is then used to follow the aging of lead free assembled chip resistors and BGA, with either ENIG or immersion Sn finishes. Two types of aging were applied: accelerated thermal cycles (ATC), and iso-thermal storage at three different temperatures. The associated failure mechanisms are compared and discussed. During ATC, microstructural changes under thermo-mechanical fatigue are evidenced, whereas thermal storage only induces intermetallic evolution, depending on the finish type. (C) 2009 Elsevier Ltd. All rights reserved.

引用

页码：1267 / 1272

页数：6