Heat Transfer Performance of Cooling Device for Avionics Equipment Using Heat Pipe

被引:0
作者
Park, Sang Jin [1 ]
Yun, Yong Hun [1 ]
Sim, Kyu Young [1 ]
Yoon, Dae Won [1 ]
Seo, Jin Kook [2 ]
机构
[1] Danam Syst Inc, Anyang Si, Gyeonggi Do, South Korea
[2] Coolings, Seoul, South Korea
关键词
Avionics Equipment; Cooling Device; Heat Pipe; Heat Transfer Performance; Heating Value;
D O I
10.3795/KSME-B.2021.45.3.165
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Because the high performance of avionics equipment is required, the heat dissipation design of electronic devices has become necessary. If the heating value of electronic devices is not adequately controlled, malfunction and degradation might occur during operation. In this study, we produced, analyzed, and tested cooling devices of avionics equipment for heat dissipation and compared them. In addition, we used the heat transfer block made of a heat pipe, aluminum, and copper. From the test results, the maximum temperature of the heat pipe was 142.3 degrees C, which was 18.0 degrees C and 12.7 degrees C lower than those of aluminum and copper, respectively. The temperature deviation was lower than that of aluminum and copper at 27.2 degrees C and 17.0 degrees C, respectively. Hence, the heat pipe exhibited the best heat transfer performance. Furthermore, we verified the safety of the working fluid inside the heat pipe.
引用
收藏
页码:165 / 171
页数:7
相关论文
共 16 条
  • [1] [Anonymous], 2011, J COMPUT STRUCT ENG
  • [2] [Anonymous], 2006, HEAT PIPES ORY DE
  • [3] ANSYS, 2020, INTR TRANS THERM AN
  • [4] Boo J. H., 1999, KOREAN ASS AIR CONDI, V16, P48
  • [5] Dod U., 2008, MILSTD810G
  • [6] Hwang K. S., 2013, RES APPL PRODUCTS TE, P11
  • [7] Incropera F.P., 2017, INCROPERAS PRINCIPLE
  • [8] Kakac S., 1991, Boilers, Evaporators, and Condensers
  • [9] Kang H. K., 2001, T KOREAN SOC MECH B, V25, P1711
  • [10] Numerical analysis for thermal design of electronic equipment using phase change material
    Lee D.K.
    Lee W.H.
    Park S.W.
    Kang S.W.
    Cho J.H.
    [J]. Lee, Dong Kyun (dongkyun.lee@lignex1.com), 1600, Korean Society of Mechanical Engineers (41): : 285 - 291