Fatigue Testing of MEMS Device Developed by MetalMUMPs Fabrication Process

被引:0
作者
Bin Islam, Syed Osama [1 ]
Abbas, Muhammad Zaeem [1 ]
Rehman, Saad [1 ]
Khan, Umar Shahbaz [1 ]
Saleem, Muhammad Mubasher [1 ]
机构
[1] Natl Univ Sci & Technol, Islamabad, Pakistan
来源
PROCEEDINGS OF THE 2016 19TH INTERNATIONAL CONFERENCE ON COMPUTER AND INFORMATION TECHNOLOGY (ICCIT) | 2016年
关键词
Fatigue; MEMS; Pull in Voltage; MetalMUMPS; FEM; Yield Strength; THIN-FILMS;
D O I
暂无
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
A very important aspect to fabricate MEMS devices, is understanding of the mechanical properties at micro-scale level. The mechanical properties of components not only depend upon the material but also on the micro-structure. Unlike other devices, MEMS components are developed from specialized micro fabrication processes in which they are subjected to cyclic loads thus producing intrinsic stresses. Loading is also produced during actuation of these devices that leads to the development of fatigue. Fatigue phenomenon is of immense importance while deliberating upon reliability of MEMS devices. In this paper, a test specimen has been tested for fatigue testing for assessment of the yield strength. Design rules of MetalMUMPs process have been followed while designing the test device. The tests were performed in FEM analysis software and the results were compared with the previously designed gold structure. The paper is aimed at incisive review of fatigue behavior in the specimen tested with designed MEMS device at specified voltage limit with a view to present analytical results and conclusions.
引用
收藏
页码:550 / 556
页数:7
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