Thermo-Mechanical Behavior of Die Attach Film on Flexible PCB Substrate for Multi-Chip Package

被引：3
|
作者：
Bang, J. O. [1 ]
Jung, K. H. [1 ]
Lee, Y. M. [2 ]
Jung, S. B. [1 ]
机构：
[1] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, Suwon 440746, Gyeonggi Do, South Korea
[2] Samsung Electromech Co, Samsung Rd 25, Sejong City 30067, South Korea
来源：
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY | 2017年 / 17卷 / 05期
关键词：
Die Attach Film (DAF); Multi-Chip Package (MCP); C-Mode Scanning Acoustic Microscope (C-SAM); Interfacial Adhesion; Void;
D O I：
10.1166/jnn.2017.14016
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
Die attach film (DAF) has been widely used as an adhesive layer in electronic packaging industry, on account of its high cohesive strength and low moisture absorption. However, Delamination of DAF might occur by voids which are induced during a post process for multi-stacking package. Therefore, the study on the correlation between the voids and mechanical properties of DAF is one of the challenging issues for development of multi-chip package (MCP). The C-mode scanning acoustic microscope (C-SAM) images show that void volume percentages were measured approximately 6% and 2% in sample 1 (S1) and 2 (S2), respectively. A peel test and a lap shear test were conducted to measure the adhesion strength of a DAF/PCB system. These results indicate that the delamination induced by voids is a decisive effect on the interfacial adhesion between the DAF and PCB.
引用
收藏
页码：3130 / 3134
页数：5
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