共 50 条
- [45] FE Simulation of Joint Volume Effect on Fracture Behavior of BGA Structure Cu/Sn3.0Ag0.5Cu/Cu Interconnects under Lap-shear Loading 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 476 - 481
- [47] Modeling of Weld Lap-shear strength for Laser Transmission Welding of Thermoplastic using Artificial Neural Network MATERIALS AND MANUFACTURING TECHNOLOGIES XIV, 2012, 445 : 454 - 459