Effect of test conditions on electromigration reliability of Sn-Ag-Cu flip-chip solder interconnects

被引：19

作者：

Lai, Yi-Shao ^{[1
]}

Lee, Chiu-Wen ^{[1
]}

Kao, Chin-Li ^{[1
]}

机构：

[1] Adv Semicond Engn Inc, Stress Reliabil Lab, Kaohsiung 811, Taiwan

来源：

JOURNAL OF ELECTRONIC PACKAGING | 2007年 / 129卷 / 01期

关键词：

electromig ration; solder bump; flip-chip; reliability; electrothermal coupling analysis;

D O I：

10.1115/1.2429710

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue reliability and morphological patterns of three solder compositions: Sn-4Ag-0.5Cu, Sn-3.5Ag-1 Cu, and Sn-3Ag-1.5Cu, subjected to two test conditions consisting of different average current densities and ambient temperatures (5 kA/cm(2) at 150 degrees C and 20 kA/cm(2) at 30 degrees C). It is interesting to realize that as the Cu weight content of the solder composition increases, the fatigue life increases under 5 kA/cm(2) at 150 degrees C but decreases under 20 kA/cm(2) at 30 degrees C. Observed electromigration morphologies along with computed current density and temperature distributions on solder interconnects from the electrothermal coupling analysis were examined, correlated, and discussed.

引用

页码：56 / 62

页数：7

共 20 条

[1] Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization [J].

Choi, WJ ;

Yeh, ECC ;

Tu, KN .

JOURNAL OF APPLIED PHYSICS, 2003, 94 (09) :5665-5671

[2] Effects upon interfacial reactions by electric currents of reversing directions [J].

Du, MY ;

Chen, CM ;

Chen, SW .

MATERIALS CHEMISTRY AND PHYSICS, 2003, 82 (03) :818-825

[3]

ELLISON GN, 1989, THERMAL COMPUTATIONS

[4] Analysis of a thermally enhanced ball grid array package [J].

Guenin, BM ;

Marrs, RC ;

Molnar, RJ .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1995, 18 (04) :749-757

[5] Thermomigration in SnPb composite flip chip solder joints [J].

Huang, AT ;

Gusak, AM ;

Tu, KN ;

Lai, YS .

APPLIED PHYSICS LETTERS, 2006, 88 (14)

[6] Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages [J].

Lai, Yi-Shao ;

Kao, Chin-Li .

MICROELECTRONICS RELIABILITY, 2006, 46 (08) :1357-1368

[7] Calibration of electromigration reliability of flip-chip packages by electrothermal coupling analysis [J].

Lai, Yi-Shao ;

Kao, Chin-Li .

JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (05) :972-977

[8] Characteristics of current crowding in flip-chip solder bumps [J].

Lai, YS ;

Kao, CL .

MICROELECTRONICS RELIABILITY, 2006, 46 (5-6) :915-922

[9]

Lai YS, 2005, ELEC COMP C, P1421

[10]

LAI YS, 2004, P 6 INT C EL MAT PAC, P314

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