A low cost 60GHz antenna in Fan-Out Panel Level Package for millimeter-wave radar application

被引：0

作者：

Huang, Guochi ^{[1
]}

Dai, Yixuan ^{[1
]}

Liu, Ningmin ^{[1
]}

Duan, Zhiyuan ^{[1
]}

Wu, Yi ^{[1
]}

Lin, Tingyu ^{[2
]}

机构：

[1] Fujian Normal Univ, Fujian Prov Engn Technol Res Ctr Photoelect Sensi, Coll Photo & Elect Engn, Fuzhou 350007, Fujian, Peoples R China

[2] Guangdong Xinhua Microelect Co Ltd, 2-F Block A Buddha High Tech, Foshan 528000, Guangdong, Peoples R China

来源：

2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2020年

基金：

中国国家自然科学基金;

关键词：

series-fed patch antena; antenna in package; millimeter wave radar; system in package; low cost; fan-out panel level package;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A linear series-fed patch array (SFPA) antenna is designed based on a low cost Fan-Out Panel Level Packaging technology. The presented antenna operates from 60GHz to 64GHz and is targeted for millimeter-wave radar application. The antenna achieves more than 10dBi radiation gain with good return loss in the entire operating bandwidth. The antenna is investigated to be less sensitive to the thickness variation of the air gap caused by the solder balls. The antenna-in-package (AiP) is a promising solution to produce a low cost high performance system-in-package (SiP) module for MMW radar system.

引用

页数：4

共 10 条

[1] Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration [J].

Braun, Tanja ;

Becker, Karl-Friedrich ;

Hoelck, Ole ;

Voges, Steve ;

Kahle, Ruben ;

Dreissigacker, Marc ;

Schneider-Ramelow, Martin .

MICROMACHINES, 2019, 10 (05)

[2]

Brunnbauer M, 2006, EL PACKAG TECH CONF, P1

[3]

Chong Y.I., 2012, 2012 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Wireless Technology and Applications, P1, DOI DOI 10.1109/IMWS2.2012.6338245

[4]

Frank M, 2018, IEEE RADIO WIRELESS, P14, DOI 10.1109/RWS.2018.8304933

[5]

Ho CY, 2019, 2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019), P110, DOI [10.23919/icep.2019.8733518, 10.23919/ICEP.2019.8733518]

[6] Chip Last Fan-out Packaging for Millimeter Wave Application [J].

Lu, Hsin-Chia ;

Wang, Yuan-Hong ;

Leou, Jeng-Long ;

Chan, Harrison ;

Chen, Scott .

2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, :1303-1308

[7]

PourMousavi M, 2013, EUR MICROW CONF, P1415

[8]

Wagner C., 2012, 2012 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), P511, DOI 10.1109/RFIC.2012.6242334

[9] A 77GHz Series Fed Weighted Antenna Arrays with Suppressed Side-Lobes in E- and H-Planes [J].

Wei, Wang ;

Wang, Xuetian .

PROGRESS IN ELECTROMAGNETICS RESEARCH LETTERS, 2018, 72 :23-28

[10]

Wojnowski M, 2008, ELEC COMP C, P290

← 1 →