High-adhesive electroless copper plating on polyethylene surface modified with primer

In this work, the region-selective electroless copper plating on the surface of calcium carbonate (CaCO3)-filled polyehtylene (PE) (CFP) films have been established based on printing primer by screen printing in combination with electroless copper plating. Results showed only the printed areas formed amine groups on the surface of CFP sheets, which served as cores for adsorbing Pd2+ ions. Thus, the pattern on the screen was transferred to the surface of CFP sheets after electroless plating. When the plated time increased from 5 to 120 min, the thickness of plated coating was enhanced from 0.12 to 10 mu m and the electrical resistivity was decreased from 12,544 to 0.4 Omega cm. The blown PE films mixed with foam powders and CaCO3 powders could form the coarse surface which can provide a large area for mechanical anchor between the primer and the plated coating, resulting in a better adhesion of the plated coating. In addition, the copper patterning possessed excellent selectivity, compactness, and flexibility. The EMI-SE of plated CFP films is above 30 dB.