A Contactless Testing Methodology for Pre-bond Interposer

被引：0
|
作者：
Jiang, Jianfei [1 ]
Sheng, Weiguang [1 ]
Wang, Qin [1 ]
Mao, Zhigang [1 ]
机构：
[1] Shanghai Jiao Tong Univ, Dept Microelect & Nanosci, Shanghai 200030, Peoples R China
来源：
2015 IEEE 58TH INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS) | 2015年
关键词：
2.5D IC; interposer; pre-bond; testing; contactless; TSV; SILICON INTERPOSER;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Silicon interposer based 2.5D IC is a promising solution for providing low interconnect delay, high bandwidth, and heterogeneous integration. It has been considered as an alternative of the 3D technology. However, testing is a big issue in 2.5D IC. This paper presents a new contactless testing mechanism for pre-bond interposer testing. Our testing mechanism attempts to detect a defective interposer from the contactless coupling. Interposer with capacitive coupling testing structure is modeled in EM solver. Simulation is carried out to verify our proposed testing methodology. The simulation results show that the proposed pre-bond interposer testing scheme can detect a defective interposer.
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页数：4
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