Unidirectional vs. simultaneous bidirectional source synchronous signaling

被引：4
|
作者：
de Araujo, DN [1 ]
Cases, M [1 ]
Pham, N [1 ]
Dreps, D [1 ]
机构：
[1] IBM Corp, Austin, TX 78758 USA
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2002年
关键词：
D O I：
10.1109/EPEP.2002.1057871
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This paper describes a case study of electrical design optimization methodology for a high-speed point-to-point source-synchronous differential simultaneous bidirectional (SiBiDi) and unidirectional interface. Strengths and weaknesses of each signaling approach are explored and tradeoffs to optimize both are described. These physical links are typically used to interconnect multiple processor subsystems to build symmetric multi-processor (SMP) systems, as well as to connect input/output (I/O) subsystems across relative long distance.
引用
收藏
页码：7 / 10
页数：4
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