Microcontacts with sub-30 μm pitch for 3D chip-on-chip integration

被引：76

作者：

Huebner, H. ^{[1
]}

Penka, S. ^{[1
]}

Barchmann, B. ^{[1
]}

Eigner, M. ^{[1
]}

Gruber, W. ^{[1
]}

Nobis, M. ^{[1
]}

Janka, S. ^{[1
]}

Kristen, G. ^{[1
]}

Schneegans, M. ^{[1
]}

机构：

[1] Infineon Technol AG, D-81739 Munich, Germany

来源：

MICROELECTRONIC ENGINEERING | 2006年 / 83卷 / 11-12期

关键词：

3D interconnect; inter metallic compound (IMC); solder balls; flip chip; system in package (SiP); lead free; solid;

D O I：

10.1016/j.mee.2006.09.026

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A low-cost soldering process-based on solid-liquid-inter-diffusion (SOLID)-for low-stress 3D-interconnects will be presented. The simple Cu(Ag)Sn metallurgy enables corrosion resistant contacts with a high melting point and excellent reliability performance. The paper, focussing on material aspects, will comprise a detailed presentation of the process flow, electrical characteristics, reliability assessment and a comparison with standard 3D interconnect approaches. The present available results confirm production readiness of the technology. (c) 2006 Elsevier B.V. All rights reserved.

引用

页码：2155 / 2162

页数：8