Design and development of a package using LCP for RF/microwave MEMS switches

被引：43
|
作者：
Chen, Morgan Jikang [1 ]
Pham, Anh-Vu H.
Evers, Nicole Andrea
Kapusta, Chris
Iannotti, Joseph
Kornrumpf, William
Maciel, John J.
Karabudak, Nafiz
机构：
[1] Univ Calif Davis, Microwave Microsyst Lab, Dept Elect & Comp Engn, Davis, CA 95616 USA
[2] Gen Elect Global Res Ctr, Niskayuna, NY 12309 USA
[3] Radant MEMS Inc, Stow, MA 01775 USA
[4] Lockheed Martin Commercial Space Syst, Newtown, PA 18940 USA
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2006年 / 54卷 / 11期
基金：
美国国家科学基金会;
关键词：
cavities; chip-on-flex; liquid-crystal polymer (LCP); microelectromechanical system (MEMS); microwave; packaging;
D O I：
10.1109/TMTT.2006.884639
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We present the development of an ultrahigh moisture-resistant enclosure for RF microelectromechanical system (MEMS) switches using liquid-crystal polymer (LCP). A cavity formed in LCP has been laminated, at low temperature, onto a silicon MEMS switch to create a package. The LCP-cap package has an insertion loss of less than 0.2 dB at X-band. E595 outgas tests demonstrate that the LCP material is suitable for constructing reliable packages without interfering with the operation of the MEMS switch. The package also passes Method 1014, MIL-STD-883 gross leak, and fine leak hermeticity tests.
引用
收藏
页码：4009 / 4015
页数：7
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