[3] Fraunhofer Inst High Frequency Phys & Radar Tech, D-53343 Wachtberg, Germany
来源:
2013 IEEE COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT SYMPOSIUM (CSICS): INTEGRATED CIRCUITS IN GAAS, INP, SIGE, GAN AND OTHER COMPOUND SEMICONDUCTORS
|
2013年
关键词:
frequency multiplier;
H-band;
heterodyne receiver;
high power amplifier (HPA);
low-noise amplifier (LNA);
medium power amplifier (MPA);
metamorphic high electron mobility transistor (mHEMT);
submillimeter-wave monolithic integrated circuit (S-MMIC);
inverse synthetic aperture radar (ISAR);
D O I:
10.1109/CSICS.2013.6659203
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
In this paper, we present the development of a millimeter-wave monolithic integrated circuit (MMIC) chipset for use in a high -resolution radar system operating at 300 GHz. The chipset consists of a frequency multiplier by twelve, a medium power amplifier, a high power amplifier and a fully integrated 300 GHz heterodyne receiver MMIC. The frequency multiplier and the two amplifier circuits have been realized using a 100 nm InAlAs/InGaAs based depletion -type metamorphic high electron mobility transistor (mHEMT) technology and achieve a saturated output power of approximately 20 dBm between 90 and 105 GHz. The 300 GHz receiver S-MMIC was fabricated using a more advanced 35 nm mHEMT technology and demonstrates a conversion gain of more than 7 dB between 270 and 325 GHz. All circuits were successfully packaged into millimeter -wave waveguide modules and used to realize a compact 300 GHz radar demonstrator, which delivers an instantaneous bandwidth of 40 GHz together with an outstanding range resolution of 3.7 mm